Cart (Loading....) | Create Account
Close category search window
 

To cut or not to cut: a thermomechanical stress analysis of polyimide thin-film on ceramic structures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Pecht, M. ; CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA ; Xin Wu ; Paik, K.W. ; Bhandarkar, S.N.

When thin-film polyimide-on-ceramic multilayered structures are subjected to thermal loads during manufacturing processes, stresses can be produced at the interface of the film and ceramic due to a mismatch in the coefficients of thermal expansion of the materials. These stresses, which may cause delamination and peeling of the films, are typically largest near the free edge of the structure. This has raised the question of whether cross-sectioning these structures to examine the interior for such defects as interfacial de-adhesion or delamination may change the stress distribution and actually generate flaws, thereby defeating the purpose of the cross-sectioning. In this paper, thermally induced stresses are evaluated for laminated thin-film Kapton on alumina structures, taking into account creep deformation and stress relaxation of the Kapton layer. After experimentation temperature and stress-dependent creep-strain constitutive models were developed; the properties of nonlinear temperature-dependent elastic-plastic and the coefficient of thermal expansion were also described. Stress analysis was performed, using plane-strain finite element analysis. It was found that sufficient stress relaxation can occur to arrest interface peeling and delamination at the free edge

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication:

Feb 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.