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Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator

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3 Author(s)
Basel, M.S. ; North Carolina State Univ., Raleigh, NC, USA ; Steer, M.B. ; Franzon, P.D.

A specialized packaging simulator is presented which uses an impulse response model of the interconnect network to model high speed digital systems. Behavioral models of drivers and receivers are used. A hierarchical strategy is developed which uses point modeling of discontinuities and the concept of coupling groups to facilitate tradeoffs between accuracy and run time. A new impulse response/convolution technique is developed to efficiently handle large distributed interconnect networks. With this technique, impulse response thresholding provides a smooth transition from delay modeling of interconnects to full distributed circuit simulation

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication:

Feb 1995

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