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MCM-L product development process for low-cost MCMs

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1 Author(s)
Thompson, P. ; Semicond. Products Sector, Motorola Inc., Tempe, AZ, USA

System size and cost reduction are often the largest factors for interest in commercial MCMs. Performance improvement is generally of secondary interest. Development and qualification can add significantly to the total cost of an MCM, so in addition to the normal desire to provide reliable products, the cost of doing so has gained increased importance. A new product introduction (NPI) process for low-cost MCMs has been implemented to rapidly provide cost-effective, reliable MCM solutions for cost-sensitive MCM users. The NPI process is based on three attributes: leverage single chip package (SCP) experience and technology, perform product family qualifications, and use only previously qualified silicon in MCMs. Application of the NPI process to the development and qualification of a 28 mm PQFP (Plastic Quad Flat Pack)-based MCM package is presented in this paper

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication:

Feb 1995

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