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A four ASIC MCM-C, design for manufacturability and the next generation silicon

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2 Author(s)
E. Fulcher ; LSI Logic, Fremont, CA, USA ; S. Patil

A ceramic MCM was designed and put into volume production. Four identical 15 mm square ASIC devices with 370 bond pads each are wirebonded into a four cavity, co-fired, alumina PGA containing 383 pins. All materials and processes were selected following the design for manufacturability principles in order to minimize risk and insure meeting schedule requirements. The results are smaller size, better electrical performance, and lower cost than four single chip CPGAs

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:18 ,  Issue: 1 )