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Optoelectronic packaging using silicon surface-micromachined alignment mirrors

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6 Author(s)
O. Solgaard ; Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA ; M. Daneman ; N. C. Tien ; A. Friedberger
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We describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-filter (single mode) coupling. In initial experiments, we measure an open-loop position accuracy of 0.2 μm, and we achieve repeatable 45% coupling efficiency with good mechanical stability.

Published in:

IEEE Photonics Technology Letters  (Volume:7 ,  Issue: 1 )