Cart (Loading....) | Create Account
Close category search window
 

XFACT: a furnace analysis and characterization tool

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kumar, R.C.K. ; Dept. of Electr. Eng., Texas A&M Univ., College Station, TX ; de Gyvez, J.P.

The diffusion furnace is one the most important and complex process equipment in the process line and efforts towards characterizing it will be well worth the effort. A CAM package for wafer temperature map reconstruction using only a few sampled data points is proposed. The software is completely generic and has no affiliation to any make of furnace. The data required for simulation can easily be obtained from the actual piece of equipment. Interpolation techniques with high accuracy are used for developing the temperature contours inside the furnace using a modified version of the Lagrange's interpolation technique

Published in:

Semiconductor Manufacturing, IEEE Transactions on  (Volume:8 ,  Issue: 1 )

Date of Publication:

Feb 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.