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XFACT: a furnace analysis and characterization tool

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2 Author(s)
Kumar, R.C.K. ; Dept. of Electr. Eng., Texas A&M Univ., College Station, TX ; de Gyvez, J.P.

The diffusion furnace is one the most important and complex process equipment in the process line and efforts towards characterizing it will be well worth the effort. A CAM package for wafer temperature map reconstruction using only a few sampled data points is proposed. The software is completely generic and has no affiliation to any make of furnace. The data required for simulation can easily be obtained from the actual piece of equipment. Interpolation techniques with high accuracy are used for developing the temperature contours inside the furnace using a modified version of the Lagrange's interpolation technique

Published in:

Semiconductor Manufacturing, IEEE Transactions on  (Volume:8 ,  Issue: 1 )

Date of Publication:

Feb 1995

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