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Microelectronics manufacturing science and technology (MMST): single-wafer RTP-based 0.35 /spl mu/m CMOS IC fabrication

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12 Author(s)
Moslehi, M. ; Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA ; Velo, L. ; Paranjpe, A. ; Chapman, R.
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We have demonstrated the total use of single-wafer processing for fast-cycle-time IC production. Rapid thermal processes have been developed for all the thermal fabrication steps required in two 0.35-/spl mu/m CMOS technologies. Complete CMOS process integration and 3-day CMOS IC manufacturing cycle time have been demonstrated with all-RTP thermal processing.<>

Published in:

Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International

Date of Conference:

5-8 Dec. 1993