Cart (Loading....) | Create Account
Close category search window

Investigations on EM field coupling in dielectric resonator

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Bhattacharjee, T. ; Dept. of Electr. Eng., New Jersey Inst. of Technol., Newark, NJ, USA ; Tu, X.

A structure consisting of a dielectric resonator (DR) placed on a substrate with a spacer in between is considered. The axisymmetric mode of coupling is considered. The theoretical expressions for the resonance fields are derived. The coefficient of coupling between the DR and the microstrip line is numerically evaluated for the limiting case where the height of the spacer goes to zero and with the assumption that the fields in the free space region outside the body of the DR and at the top of the substrate is negligibly small. The numerical results show excellent agreement with the experimental results. The effects of the substrate thickness on the coupling coefficient are also examined

Published in:

Magnetics, IEEE Transactions on  (Volume:25 ,  Issue: 4 )

Date of Publication:

Jul 1989

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.