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Browse Conference Publications > Thermal Phenomena in Electron ... Help

Coarse and detailed CFD modelling of a finned heat sink

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2 Author(s)
Linton, R.L. ; Mech./Acoust./Thermal/Vibrations Lab., IBM Corp., Austin, TX, USA ; Agonaber, D.

CFD modelling of electronic components becomes increasingly more important as CFD spreads into the design process. This paper compares the results of a detailed CFD model of a heat sink with experimental data. Then a technique for representing the heat sink in a coarse manner in a CFD model is presented and compared with the detailed CFD model. Agreement is quite good, indicating that this technique can be used when representing heat sinks in larger card or system models

Published in:
Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on

Date of Conference: 4-7 May 1994

Page(s):
156 - 161
Meeting Date :
04 May 1994-07 May 1994
Print ISBN:
0-7803-1372-0
INSPEC Accession Number:
4823768
Conference Location :
Washington, DC
Digital Object Identifier :
10.1109/ITHERM.1994.342902
Product Type:
Conference Publications

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