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Enhancement of two-phase thermosyphon for cooling high heat flux power devices

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5 Author(s)
H. Kuwahara ; Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan ; K. Takahashi ; T. Nakajima ; O. Suzuki
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The purpose of this study is the enhancement of cooling of high heat flux power devices such as a thyristor by a thermosyphon system. The thermosyphon used boiling and condensation of inert dielectric fluorocarbon (FC-72). Boiling occurred from a multiple chimney heat transfer structure. A boiling chamber is connected to the condenser by a double tube, with the inner tube carrying the condensed liquid and the outer annulus carrying vapor. Using the experimental model of a thermosyphon, heat flux capacity was enhanced by increasing the flow tube height Ho, boiling chamber height Hh, and condenser liquid level Hl. High heat flux capacity was achieved with H 0>8 cm, Hh>10 cm, and Hl>H0, using chimney heat transfer structure with a channel width of 3 mm. The thermosyphon system was able to cool a maximum heat flux of 3 kW per device

Published in:

Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on

Date of Conference:

4-7 May 1994