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Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines

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2 Author(s)
Kok, P.A. ; Dept. of Inf. Technol., Ghent Univ., Belgium ; De Zutter, D.

An integral equation-based quasi-static method is described for calculating the capacitance of multilayer board via's. The considered via geometry contains connecting strips, pads on the via, and a finite ground plane thickness. After showing that coupling through ground plane openings is very small for realistic configurations, via's are treated as a number of independent sections (one section per multiboard layer). The influence of the geometric parameters on the via capacitance is examined; results are also compared with previous publications and with measurements

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:42 ,  Issue: 12 )