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Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modules

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3 Author(s)
D. Shangguan ; Electron. Div., Ford Motor Co., Dearborn, MI, USA ; A. Achari ; W. Green

As part of the lead-free solder development process currently underway, this paper presents the evaluation of the lead-free Sn-Ag solder for use in no-clean thick film electronics packages. The Sn-Ag (96.5/3.5 wt%) eutectic solder alloy, with a no clean flux system, is the focus of this study. Based on studies of metallurgical interactions, the conductor/substrate adhesion, and electromigration/dendritic growth, it is concluded that this solder has superior overall properties and is suitable for solder interconnects in thick film automotive electronics packages when used with a mixed bonded Ag conductor

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:17 ,  Issue: 4 )