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Demountable TAB-a new path for TAB technology

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5 Author(s)
Pendse, R.D. ; Hewlett-Packard Co., Palo Alto, CA, USA ; Afshari, B. ; Heflinger, B. ; Matta, F.
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Despite its advantages, the proliferation of TAB technology in the high lead count single chip packaging world has been somewhat limited by factors such as high entry cost and complex board-level assembly methods. In the area of MCM's, the difficulty of rework/repair of TAB emerges as a serious limiter. The TAB package developed at Hewlett-Packard addresses these very issues by providing bumpless inner lead bonding and demountable outer lead connection (hence called Demountable TAB, or DTAB). In the present paper, a comprehensive compilation of the DTAB packaging scheme is presented. The package construction, assembly procedure, PC board design considerations, thermal performance, electrical characterization and reliability testing are presented in detail

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:17 ,  Issue: 4 )

Date of Publication:

Nov 1994

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