By Topic

“High-Power Microwave” tubes: in the laboratory and on-line

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Caryotakis, G. ; Linear Accel. Center, Stanford Univ., CA, USA

The possibility of incapacitating the electronic circuits of hostile equipment with high-energy microwave pulses has created a demand for microwave tubes capable of very high peak pulsed powers. Experimentalists, primarily from the plasma physics community, have been working in this field, dubbed High-Power Microwave or HPM. Separately, research in high-energy physics requires electron-positron colliders with energies approaching 1 trillion electron-volts (1 terra-electron-volt, or TeV). Such accelerators must be powered by microwave sources that are very similar to some that are proposed for the HPM application. The paper points out that for these tubes to be used on-line in the manner intended, they must be designed and built to operate at a very high internal vacuum, which is not the case for many of the HPM laboratory projects. The development of a particular klystron at the Stanford Linear Accelerator Center is described in detail in order to illustrate the need for special facilities and strong quality control. Should the defense requirements for HPM survive the end of the cold war, an effort should be made to coordinate the tube development activities serving these two widely disparate applications

Published in:

Plasma Science, IEEE Transactions on  (Volume:22 ,  Issue: 5 )