Referenced Items are not available for this document.
This paper presents a generalized method for analyzing microstrip structures with finite metallization thickness. A spectral-domain approach that adopts proper current expansion functions is employed to find the three-dimensional current distribution in a finitely thick microstrip. Comparison of computed dispersion curves with available published data for microstrip lines of finite thickness illustrates the accuracy of this method. The influence of metallization thickness on discontinuities like patches and open-ends is also demonstrated.<
Published in:
Microwave Symposium Digest, 1994., IEEE MTT-S International
Date of Conference: 23-27 May 1994
- Page(s):
- 1009 - 1012 vol.2
- Meeting Date :
- 23 May 1994-27 May 1994
- ISSN :
- 0149-645X
- Print ISBN:
- 0-7803-1778-5
- INSPEC Accession Number:
- 4795614
- Conference Location :
- San Diego, CA, USA
- Digital Object Identifier :
- 10.1109/MWSYM.1994.335185
- Product Type:
- Conference Publications
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