Low temperature fired NiCuZn ferrite

Bismuth oxide (Bi/sub 2/O/sub 3/) and lead glass were introduced to NiCuZn ferrite to reduce the sintering temperatures from more than 950/spl deg/C to 875/spl deg/C for co-firing with the internal conductor, Ag. Both additives formed liquid phases in grain boundaries during the sintering process to enhance the densification of the specimens. The chip inductors made of the Bi/sub 2/O/sub 3/ doped ferrite exhibited higher DC resistance than the un-doped formulation due to the intensified Ag diffusion by the aforementioned liquid phase.<
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