By Topic

An enhanced technique for simulating short-circuit power dissipation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
G. Y. Yacoub ; California Univ., San Diego, CA, USA ; W. H. Ku

A circuit-simulation technique which permits the measurement of the average short-circuit power dissipation component in integrated circuits using SPICE is presented. It is an extension of a previously presented scheme by S.M. King (see ibid., vol.21, no.5, p.889-91, 1986) which measures average power dissipation while circuits are being simulated. The extended technique is most appropriate for low-power circuit design. It can be applied effectively to any complementary circuit structure, such as CMOS, that does not permit current flow (other than leakage current) during steady-state operation. Results for differently Wp/Wn ratioed W p/Wn CMOS circuits are shown

Published in:

IEEE Journal of Solid-State Circuits  (Volume:24 ,  Issue: 3 )