By Topic

On yield consideration for the design of redundant programmable logic arrays

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Chin-Long Wey ; Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA

Redundancy techniques have been applied to conventional programmable logic arrays (PLAs) to allow for the repair of defective chips. When the redundancy technique is implemented in a VLSI or WSI chip design, the increased cost is proportional to the increased chip silicon area, and the additional spare lines can increase the silicon area and propagation delay. However, if the provided redundancy can be efficiently utilized to repair defective chip; then the additional spare lines may increase rather than decrease the chip yields. The possibility of yield enhancement through redundant design is analyzed, showing that the chip yield is increased significantly

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:7 ,  Issue: 4 )