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Numerical modeling of a micromachined thermal conductivity gas pressure sensor

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5 Author(s)
Allegretto, W. ; Dept. of Math., Alberta Univ., Edmonton, Alta., Canada ; Shen, Bing ; Haswell, P. ; Lai, Zhongsheng
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We have developed a software package that simulates the operation of a silicon micromachined CMOS thermal conductivity gas pressure gauge. The performance of actual devices was compared against the simulated operation and was found to be in good agreement. The 3-dimensional simulation was reduced to two 2-dimensional simulations to reduce complexity. The two equations resulting from steady state energy balance considerations were discretized and an iterative nonlinear Gauss-Seidel procedure applied to solve the system of equations. Temperature profiles and contours were calculated and the effect of geometric and materials modifications was demonstrated

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Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:13 ,  Issue: 10 )