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Browse Journals & Magazines > Components, Packaging, and Ma ...> Volume:17 Issue:3 Help

Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)

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3 Author(s)
Seaman, M.E. ; IBM Corp., Hopewell Junction, NY, USA ; Economikos, L. ; Lambright, J.

Computer vision techniques have been developed and implemented for automatic optical inspection (AOI) of multichip modules with thin films. A case study, detailing the application of the techniques based on an Orbot TF501 visual inspection system platform for a high density grid of circular pads, is presented. The techniques presented here are capable of detecting electrical and non-electrical defects such as near shorts, wrong metallurgy, contamination, etc

Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:17 ,  Issue: 3 )

Date of Publication: Aug 1994

Page(s):
291 - 299
ISSN :
1070-9894
INSPEC Accession Number:
4765708
Digital Object Identifier :
10.1109/96.311776
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Aug 1994
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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