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Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)

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3 Author(s)
Seaman, M.E. ; IBM Corp., Hopewell Junction, NY, USA ; Economikos, L. ; Lambright, J.

Computer vision techniques have been developed and implemented for automatic optical inspection (AOI) of multichip modules with thin films. A case study, detailing the application of the techniques based on an Orbot TF501 visual inspection system platform for a high density grid of circular pads, is presented. The techniques presented here are capable of detecting electrical and non-electrical defects such as near shorts, wrong metallurgy, contamination, etc

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:17 ,  Issue: 3 )