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Ceramic multicomponent modules: a new approach to miniaturization

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1 Author(s)
Keizer, P.H.M. ; Ceramic Innovation Centre, Philips Components, GG Roermond, Netherlands

The demand for increasing miniaturization of electronic systems enforces component manufacturers to develop new generations of small-sized components to cope with the required high component density. Reducing the size of individual components beyond the 0402 size seems not to be the best solution, as further miniaturization is limited by interconnection and placement requirements. In the design of ceramic multicomponent modules (CMM's), a different approach is followed. Employing well-accepted technologies, based on a high quality ceramic multilayer technology and thick- (or thin-) film resistor networks, customer specific modules are realized through the integration of capacitors and resistors into a single ceramic module. In addition, active elements can be mounted on top. In this way a high density of (passive) functions can be obtained in an easy mountable package. The CMM concept will be explained. In addition, the possibilities for miniaturization are addressed. Furthermore, the aspect of interconnecting the CMM to the printed circuit board (PCB) is discussed

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:17 ,  Issue: 3 )