Cart (Loading....) | Create Account
Close category search window

Spectral domain technique using surface wave excitation for the analysis of interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Petre, P. ; Compact Software Inc., Paterson, NJ, USA ; Swaminathan, M.

Analysis of interconnects is an area of prime importance in packaging since the characteristics of the interconnections eventually dictate the performance of the package. The analysis consists of two parts, namely, parameter extraction and package simulation where the former represents the computation of the line parameters such as resistance, inductance, capacitance, and conductance (R, L, C, G). At high frequencies, the line parameters vary with frequency which requires a complete solution to Maxwell's equation for parameter extraction. This translates to the computation of the propagation constant as a function of frequency β(ω) which is the focus of the work in this paper. Since packages typically consist of periodic structures, the spectral domain technique (SDT) lends itself to easy analysis and has therefore been used in this paper. A new method utilizing the surface wave excitation principle applied to the scattering problem has been used to compute β(ω) which is different from the eigenvalue solution that has been used in the past. Using the present formulation, a single algorithm can be used both for the computation of wave propagation and scattering/radiation by changing the angle of the incident wave

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:42 ,  Issue: 9 )

Date of Publication:

Sep 1994

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.