Cart (Loading....) | Create Account
Close category search window

Comments on "Improvement in calculation of some surface integrals: application to junction characterization in cavity filter design" [with reply]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Gentili, G.G. ; Dipartimento di Elettronica e Inf., Politecnico di Milano, Italy ; Guillot, P. ; Baudrand, H.

The original authors claim to have developed a rigorous method allowing the reduction of a surface integral to a contour integral with application to mode-matching analysis of waveguide junctions. The authors have applied the method to analyze the transition from circular waveguide to rectangular waveguide. This same method has been previously derived in its general form. Some preliminary results on the discontinuity between ridged and rectangular waveguide have been presented. The only original contribution recognized is therefore the application to the analysis of coupling between circular cavities through rectangular irises. The original authors give their reply.<>

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:42 ,  Issue: 8 )

Date of Publication:

Aug. 1994

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.