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Liquid dropping resin for IC encapsulation

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3 Author(s)
Yamaoka, S. ; Sumitomo Bakelite Co. Ltd., Kanagawa, Japan ; Kusuhara, A. ; Okabe, Y.

One method to encapsulate bare ICs on an organic substrate uses liquid epoxy resin. A type of liquid epoxy resin for use in tape automated bonding plastic leaded chip carrier, plastic-base pin grid array, and IC card is discussed. Epoxy resin used for this purpose should be of high reliability, comparable to that of the monolithic ICs which had not been realized on conventional resins used for chip-on-board applications. In order to meet these requirements, the characteristics of resin which yield high reliability, and methods to improve these characteristics have been studied. Effective factors which had been found to contribute to higher reliability are discussed

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:11 ,  Issue: 1 )