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YAG laser assisted etching for releasing silicon micro structure

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6 Author(s)
Minami, K. ; Fac. of Eng., Tohoku Univ., Sendai, Japan ; Wakabayashi, Y. ; Matsubara, T. ; Yoshimi, K.
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YAG laser assisted etching techniques were developed and investigated for releasing silicon micro structures. HCl, SF6 etc., which produce volatile exhaust, were used as etching gas at atmospheric pressure. The YAG laser assisted etching was applied to fabricate an electrostatic microactuator, a resonating sensor and accelerometers. This resistless dry etching can be applied to three-dimensional structures

Published in:

Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.

Date of Conference:

7-10 Feb 1993