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Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

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4 Author(s)
A. Iqbal ; Amdahl Corp., Fremont, CA, USA ; M. Swaminathan ; M. Nealon ; A. Omer

The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:17 ,  Issue: 1 )