Cart (Loading....) | Create Account
Close category search window
 

Delay and reflection noise macromodeling for signal integrity management of PCBs and MCMs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Simovich, S. ; Dept. of Electr. & Comput. Eng., North Carolina State Univ., CA, USA ; Mehrotra, S. ; Franzon, P. ; Steer, M.

The current approaches to generating wiring rules for high speed PCBs and MCMs are unsatisfactory because they require intensive manual efforts or use over-simplifications In this paper, an automated approach based on a-priori simulation-based characterization of the interconnect circuit configurations is presented. The improved flexibility and accuracy provided by this approach, when compared with traditional approaches, are demonstrated via an MCM interconnect example

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:17 ,  Issue: 1 )

Date of Publication:

Feb 1994

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.