Cart (Loading....) | Create Account
Close category search window
 

Effect of pulse plating parameters on electrical contact behavior of nickel coatings

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Benhenda, S. ; Dept. de Phys. Atomique et Moleculaire, Rennes I Univ., France ; Ben Jemaa, N. ; Bourir, M.

Pulse and DC plated nickel coatings onto copper substrates were investigated in view of their use as underlayer in Au/Ni/Cu or as external protective coatings. Deposition parameters were varied in order to determine their influence on the microstructures - and consequently on the electrical contact properties - of the electrodeposited Ni films. XRD analysis, roughness and hardness measurements, as well as SEM studies were performed on these samples. Preferred orientation and microstructure changes were observed as current density and pulse plating frequency were increased. Smooth and dense coatings were obtained for high pause-to-pulse ratio, 25-75 Hz pulse-plating frequencies, and low current density. The contact resistances Rc of the as-deposited samples in approach and insert mode were measured versus load Fc in the range 0.1-10 N. It was found that initial contact resistance follows the power law Rc=KF c-n, where n is hardness and coating topography dependent. Moreover, aging samples in daily cyclic atmosphere shows an increase in contact resistance during the test, but ohmic behavior prevails as verified by current-voltage characteristics. Finally, mechanical behavior investigated by fretting study shows that the pulse reverse condition improves contact resistance stability

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:17 ,  Issue: 2 )

Date of Publication:

Jun 1994

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.