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The tradeoff between peripheral and area array bonding of components in multichip modules

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3 Author(s)
Sandborn, P.A. ; Microelectron. & Comput. Technol. Corp., Austin, TX, USA ; Abadir, M.S. ; Murphy, C.F.

This paper examines the tradeoff between peripheral I/O format die (for wirebonding, tape automated bonding (TAB), or peripheral flip chip bonding) and area array I/O format die (for flip chip bonding), as a function of partitioning a fixed functionality into a variable number of die. The comparison in this study has been made in the context of a multichip module (MCM). The analysis approach used concurrently considers module size, thermal and electrical performance, and cost (including module-level test and rework) to assess the overall applicability of one bonding format over the other

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:17 ,  Issue: 2 )