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New GaAs-MMIC process technology using low-temperature deposited SrTiO3 thin film capacitors

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6 Author(s)
Nishitsuji, M. ; Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Osaka ; Tamura, A. ; Yahata, K. ; Shibuya, M.
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The authors have developed a new GaAs-MMIC process technology using low-temperature deposited SrTiO3 thin film capacitors which were combined with WSi-gate selfaligned FETs. The SrTiO3 films were successfully deposited at 200°C by the RF magnetron sputtering method without degrading the FET characteristics. By integrating these on-chip SrTiO3 bypass capacitors onto the GaAs IC, the parasitic inductance from the source to ground interconnection was successfully reduced and an enhanced gain characteristic was obtained for a self-biased amplifier circuit

Published in:
Electronics Letters  (Volume:30 ,  Issue: 13 )

Date of Publication: 23 Jun 1994

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