The authors have developed a new GaAs-MMIC process technology using low-temperature deposited SrTiO3 thin film capacitors which were combined with WSi-gate selfaligned FETs. The SrTiO3 films were successfully deposited at 200°C by the RF magnetron sputtering method without degrading the FET characteristics. By integrating these on-chip SrTiO3 bypass capacitors onto the GaAs IC, the parasitic inductance from the source to ground interconnection was successfully reduced and an enhanced gain characteristic was obtained for a self-biased amplifier circuit
Published in:
Electronics Letters
(Volume:30
,
Issue:
13
)
Date of Publication: 23 Jun 1994