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Fabrication techniques for a novel three-dimensional monolithic integrated circuit transmission line in silicon

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3 Author(s)
A. D. Yarbrough ; Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA ; G. C. Dalman ; C. A. Lee

A novel integrated circuit transmission line, trench waveguide, has been developed for high frequency/high speed applications. The three-dimensional structure is suitable as a low impedance interconnect. The fabrication process developed uses special wet etch, and angle evaporation techniques. Measurements on large-scale models of the device yielded impedances as low as 12 Ω

Published in:

Electronics Letters  (Volume:24 ,  Issue: 25 )