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Browse Journals & Magazines > Electronics Letters ...> Volume:30 Issue:11 Help

Thermal comparison of long-wavelength vertical-cavity surface-emitting laser diodes

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2 Author(s)
Piprek, J. ; Mater. Sci. Programme, Delaware Univ., Newark, DE ; Yoo, S.J.B.

Heat flow finite element analysis is applied to basic device concepts, including planar structures with InGaAsP/InP or AlAs/GaAs substrate side mirrors (mounted top-up or top-down) and etched-well lasers with Si/SiO2 dielectric mirrors. In several cases, the calculated thermal resistance values are higher than with short-wavelength devices, but wafer-fused structures on GaAs substrate show clear thermal advantages

Published in:
Electronics Letters  (Volume:30 ,  Issue: 11 )

Date of Publication: 26 May 1994

Page(s):
866 - 868
ISSN :
0013-5194
INSPEC Accession Number:
4707773
Digital Object Identifier :
10.1049/el:19940589
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
26 May 1994
Sponsored by :
Institution of Engineering and Technology

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