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Numerical and experimental investigation of heat transfer phenomena over an electronic module

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2 Author(s)
Agonafer, D. ; IBM Corp., Poughkeepsie, NY, USA ; Furkay, S.

Summary form only given. The three-dimensional conjugate heat transfer problem associated with a heat-dissipation electronic component placed in a forced-convection environment is discussed. Both numerical and experimental data are presented for forced-convection heat transfer over an individual, card-mounted electronic module. The numerical approach was twofold. First, the time-averaged equations depicting the turbulent flow field were integrated using a commercial finite-difference code (PHOENICS). The electronic package, in this case, was represented as a conducting solid. The resulting heat transfer coefficient data were used as boundary conditions for subsequent conduction analysis of the package which was in this case quite detailed with respect to internal material/geometry. The CAEDS program, a commercially available finite-element simulation system, was used to perform the conduction computations. Experimental data were acquired for individual components surface-mounted to small sections of epoxy circuit card. Component surface temperatures, air temperature, and chip temperature were measured and the results compared with simulations

Published in:

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Date of Conference:

11-13 May 1988