Cart (Loading....) | Create Account
Close category search window
 

Magnetic properties of Fe73.5Cu1Nb3(SixB1-x )22.5 (x=0.4-0.8) alloy ribbons quenched from different melt temperatures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Pi, W.K. ; Magnetic Mater. Lab., Korea Inst. of Sci. & Technol., Seoul, South Korea ; Lim, S.H. ; Noh, T.H. ; Kim, H.J.
more authors

In order to examine the melt temperature effects of alloys with varying degrees of glass forming ability, the magnetic properties of nanocrystalline Fe73.5Cu1Nb3(Six B1-x)22.5 (x=0.4-0.8) alloys are investigated. It is found that for all the alloys, except for x=0.8, the soft magnetic properties of the ribbons quenched at the high melt temperature are better than those of the ribbon fabricated at the low melt temperature, and that the magnitude of improvement in the magnetic properties with increased melt temperature decreases with decreasing glass-forming ability. It is argued that the glass-forming ability of an alloy should be taken into account in considering the melt temperature effects

Published in:

Magnetics, IEEE Transactions on  (Volume:29 ,  Issue: 6 )

Date of Publication:

Nov 1993

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.