Cart (Loading....) | Create Account
Close category search window
 

Packaging alternatives for high lead count, fine pitch, surface mount technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chroneos, R. ; Intel Corp., Chandler, AZ, USA ; Mallik, D. ; Prough, S.

It is noted that fine pitch SMT (surface mount technology) components potentially offer substantial benefits for cost, performance, and miniaturization in assembly of high integration, high lead count ICs in portable electronic systems. However, several issues involving component handling, solder process, rework, and reliability concerns must first be overcome. It is noted that a variety of packaging alternatives exist today for surface mount high leadcount components. Any choice must address these surface mount issues as well as the requirements of next-generation highly integrated, high-performance IC devices. Details of various packaging alternatives are discussed

Published in:

Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International

Date of Conference:

16-18 Sep 1991

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.