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A universal testability strategy for multi-chip modules based on BIST and boundary-scan

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1 Author(s)
Y. Zorian ; AT&T Bell Lab., Princeton, NJ, USA

A testability strategy that can be implemented mainly by incorporating built-in self-test (BIST) and boundary scan during the chip design cycle is presented. On the basis of these, the testing and diagnosis procedures needed to meet the quality requirements of multichip module (MCM) manufacturing, and hence reaching acceptable MCM assembly yields is demonstrated. The proposed testability strategy can be considered universal, since it is independent of silicon, substrate, or attachment technologies adopted to build the MCM

Published in:

Computer Design: VLSI in Computers and Processors, 1992. ICCD '92. Proceedings, IEEE 1992 International Conference on

Date of Conference:

11-14 Oct 1992