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Correlation of analytical and experimental approaches to determine thermally induced PWB warpage

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5 Author(s)
Chao-Pin Yeh ; Res. Center, Motorola Inc., Schaumburg, IL, USA ; Ume, C. ; Fulton, R.E. ; Wyatt, K.W.
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Thermomechanical design effects in the printed wiring board (PWB) design process are considered, In particular, a research project for developing advanced finite-element method (FEM)-oriented capabilities to simulate thermally induced PWB warpage is reported. The FE analysis results are validated by correlating them with measurements obtained from a separate experimental approach using the shadow Moire method

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:16 ,  Issue: 8 )