Development of a cost-effective high-performance metal QFP packaging system

The design and development of MQUAD technology is described. The MQUAD packaging system is a high-performance, reliable technology currently in use for packaging of microprocessors and high-speed ASIC devices, including CMOS, BiCMOS, bipolar, gallium arsenide, and other high performance ICs. The packaging technology is being used for devices dissipating up to 14 W and switching speeds of up to 300 MHz. The design and development was carried out with the objectives of high thermal performance (up to 15 W); high electrical performance, with inductance and capacitances lower than those of comparable plastic quad flat packs (PQFPs); and reliability superior to that of the PQFPs. The approach taken was to use an adhesively bonded metal package. Reliability tests performed included temperature cycling, thermal shocks, solvent resistance, flammability, pressure cooker, and vapour phase shocks. Electrical characterization included theta /sub ja/ and theta /sub jc/ and resistance, inductance, and capacitance measurements.<
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