Referenced Items are not available for this document.
This work benchmarks the current reliability tests used by the electronics industry, examines those tests that affect and are affected by molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability; package stresses; package cracking; halogen-induced intermetallic growth at bond pads; moisture-induced corrosion; and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended
Published in:
Reliability, IEEE Transactions on
(Volume:42
,
Issue:
4
)
Date of Publication: Dec 1993
- Page(s):
- 518 - 535
- ISSN :
- 0018-9529
- INSPEC Accession Number:
- 4671093
- Digital Object Identifier :
- 10.1109/24.273570
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec 1993
- Sponsored by :
- IEEE Reliability Society
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
