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Molding compound trends in a denser packaging world: qualification tests and reliability concerns

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4 Author(s)
Nguyen, L.T. ; Nat. Semicond. Corp., Santa Clara, CA, USA ; Lo, R.H.Y. ; Chen, A.S. ; Belani, J.G.

This work benchmarks the current reliability tests used by the electronics industry, examines those tests that affect and are affected by molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability; package stresses; package cracking; halogen-induced intermetallic growth at bond pads; moisture-induced corrosion; and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended

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Reliability, IEEE Transactions on  (Volume:42 ,  Issue: 4 )