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Thermal isolation of high-temperature superconducting thin films using silicon wafer bonding and micromachining

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5 Author(s)
C. A. Bang ; Dept. of Mech. Eng., MIT, Cambridge, MA, USA ; J. P. Rice ; M. I. Flik ; D. A. Rudman
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Using a new micromachining technology, thermally isolated thin films of high-temperature superconductor have been microfabricated. The intended application for these structures is in infrared bolometers. A silicon wafer bonding process produces a low thermal mass island of single-crystal silicon on a silicon nitride membrane which provides thermal isolation. The silicon can act as a seed for the epitaxial growth of YBa2Cu3O7 on a yttria-stabilized zirconia buffer layer. This paper describes the overall concept of the thermally isolated device, and demonstrates that the micromachined structure can be fabricated with high-quality superconducting films

Published in:

Journal of Microelectromechanical Systems  (Volume:2 ,  Issue: 4 )