By Topic

Mechanical properties of fine grained polysilicon-the repeatability issue

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Guckel, H. ; Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA ; Burns, D.W. ; Tilmans, H.A.C. ; DeRoo, D.W.
more authors

Calculation and measurements of Young's modulus, Poisson's ratio, shear modulus, and internal strain for fine-grained polysilicon as a function of processing conditions are presented. Calculations are based on appropriate averaging of single-crystal silicon properties, taking into account the film morphology. Experimental data are taken from strain diagnostic and resonant beam structures. It is found that polysilicon films can be in tension and that the intrinsic quality factor is approaching 75000.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Date of Conference:

6-9 June 1988