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A forecast on the future of hybrid wafer scale integration technology

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1 Author(s)
Fillion, R.A. ; Corp. Res. & Dev. Center, Gen. Electr. Co., Schenectady, NY, USA

Any detailed discussion of high performance packaging for the next generation electronics systems must include both hybrid wafer scale integration (H-WSI) and monolithic wafer scale integration (M-WSI). A H-WSI circuit is a multichip module (MCM) that contains 20-50 chips with at least ten times the maximum functionality that can be readily achieved in one complex chip. A M-WSI circuit is a monolithic semiconductor (silicon generally) chip that contains a large number of cells that in total contain at least ten times the functionality that can be readily achieved in one complex chip. These devices could be called a system on a chip. This paper describes the driving forces behind WSI technologies, defines where the H-WSI technologies are today and forecasts where these are likely to evolve to in the future

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:16 ,  Issue: 7 )