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Development of novel architecture and assembly techniques for a detector unit for a silicon microvertex detector using the flip-chip bonding method

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26 Author(s)
Y. Saitoh ; SEIKO Instruments Inc., Chiba, Japan ; J. Yamanaka ; H. Suzuki ; S. Miyahara
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Full-size models of a detector unit for a silicon microvertex-detector for the KEK B factory are built. The model consists of four dummy double-sided, double-metal silicon microstrip detectors and two silicon end boards with dummy readouts VLSIs mounted on both sides. In this trial the flip-chip bonding (FCB) method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 μm. The structure using the FCB method successfully provides a new architecture for the detector unit of a vertex detector

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IEEE Transactions on Nuclear Science  (Volume:40 ,  Issue: 4 )