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In-line automated inspection for semiconductor assembly

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1 Author(s)
S. -P. T. Wang ; Motorola Inc., Chandler, AZ, USA

Several in-line automated inspection techniques for semiconductor assembly are discussed. First, the characteristics of in-line automated inspection are described. Then, a machine vision system that is being developed for TAB tape inspection is presented. Machine vision techniques for two-dimensional and three-dimensional flaw inspection are proposed. A laser/infrared technique, scanning laser acoustic microscopy (SLAM), and a 3D X-ray technique that are capable of nondestructive inspection are evaluated

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Date of Conference:

30 Sep-1 Oct 1992