Silicon nitride deposited by electron-cyclotron resonance has been used to fully passivate InAlAs/InGaAs HFETs. The passivation process did not increase the gate leakage current, and passivated 1 mu m HFETs had a breakdown voltage of 15 V. These results illustrate the potential of ECR nitride for passivation of InP-based semiconductor devices.
Published in:
Electronics Letters
(Volume:29
,
Issue:
5
)
Date of Publication: 4 March 1993