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A statistical method for obtaining the factors in electronic-component reliability-prediction models

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2 Author(s)
Yang, Z. ; Dept. of Comput. Sci., Regina Univ., Saskatchewan, Sask., Canada ; Raafat, H.

According to US Mil-Hdbk-217, the failure rate of most electronic components can be predicted as λpb×π1 ×π2···πn. A statistical method of obtaining these parameters is presented. The method is based on large quantities of field data, and the more current the data are, the more accurate the values of each level of λb and πi. Using these values, the models in US Mil-Hdbk-217 can be applied to predict the life of electronic products. The method can also be used to verify the present values of each level of λb and πi, and to provide the basis of further amendment

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Reliability, IEEE Transactions on  (Volume:41 ,  Issue: 4 )