High-mobility poly-Si thin-film transistors (TFTs) were fabricated by a novel excimer laser crystallization method based on dual-beam irradiation. The new method can reduce the solidification velocity of the top Si layer by heating the bottom Si layer of the Si/SiO2/Si/glass substrate structure by means of laser irradiation not only from the front side but also from the back side. The grain size of poly-Si film was enlarged up to 2 μm. The field-effect mobilities of the TFT exceeded 380 cm2/V-s for electrons and 100 cm2/V-s for holes
Published in:
Electron Devices, IEEE Transactions on
(Volume:40
,
Issue:
1
)
Date of Publication: Jan 1993