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Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

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8 Author(s)
D. F. Fayette ; Rome Lab., Griffiss AFB, NY, USA ; P. Speicher ; M. J. Stoklosa ; J. V. Evans
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A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screen criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.<>

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IEEE Aerospace and Electronic Systems Magazine  (Volume:8 ,  Issue: 8 )