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Al-plug stacked contact/via process for deep submicron CMOS multilayer metal technology

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5 Author(s)
Liou, F.-T. ; Sgs-Thomson Microelectron., Carrollton, TX, USA ; Chen, F.S. ; Dixit, G.A. ; Zamanian, M.
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The authors describe stacked contact/via technology with Al-plug metallization that results in complete filling of submicron contacts and vias of various sizes. The Al-plug process can be done in a conventional sputtering system. Physical and electrical characteristics of the Al-plug process are compared with conventional W-plug process. The implementation of Al-plug technology into submicron integrated circuits is presented

Published in:

VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on

Date of Conference:

22-24 May 1991

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