Cart (Loading....) | Create Account
Close category search window
 

Photothermal formation of copper conductors on multichip module substrates using a Nd:YAG laser

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Muller, H.G. ; Microelectronics & Comput. Technol. Corp., Austin, TX, USA

A simple method for laser direct writing of copper from copper formate precursor films has been developed. Unlike previously reported laser processes involving the decomposition of solid precursor films, this process does not require any postprocessing (e.g., plating) to enhance the deposits in thickness or conductivity. Precursor crystallization has been completely eliminated by introduction of glycerol into the precursor. The lateral resolution has been improved by replacing the commonly used CW laser with a 100-kHz Q-switched laser of much lower average power, allowing for deposition of copper lines less than 20-μm wide. Thousands of individual conductors per substrate with thicknesses of 4-6 μm and resistivities below 10 μΩ-cm are routinely obtained with this method

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:16 ,  Issue: 5 )

Date of Publication:

Aug 1993

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.